Publications

Read up on our peer reviewed publications

High‑Throughput MIP+ Etching for Failure Analysis of SoIC Packages

By Aaron Lee, Bernice Zee, Frederick Owen Zhong, Ya-Shan Peng and Jiaqi Tang
AMD Singapore, Nanyang Technological University and JIACO Instruments

Exposed EEPROM on PCB after MIP Decapsulation

Hardware Security Evaluation of Advanced Packaging

Nanyang Technological University, ISTFA 2025, Die & Data Extraction, PCB, SiP, Cu Bond Wire.

Undamaged GaAs device after recieving an MIP decapsulation

Efficient Preparation of GaAs Devices Utilizing Microwave Induced Plasma Decapsulation

Analog Devices, ISTFA 2025, GaAs.

Repackaged device after MIP decap

Revolutionizing IC Package Decapsulation with Microwave-Induced-Plasma (MIP) System

Infineon, IPFA 2025, Cu Bond Wire, Repackaging.

A subtle bonding failure

Accelerating Root Cause Identification of Subtle Bonding Failures Using MIP

Texas Instruments, ECTC 2025, Cu Bond Wire, Reliability Test.

Intact RDL traces on a WLCSP device after MIP decapsulation

Polyimide removal approach on redistribution layer of WLCSP package using Microwave Induced Plasma

Altera, IPFA 2025, RDL, CSP.