𝗜𝗦𝗧𝗙𝗔 𝟮𝟬𝟮𝟱: 𝗧𝗼𝗼𝗹𝘀 𝗼𝗳 𝘁𝗵𝗲 𝗧𝗿𝗮𝗱𝗲! 

This Monday (17th of November), our colleagues Sarah Zerouali and Mark McKinnon presented ”The Tools of the Trade” at JIACO Instruments booth (#715).

They introduced ISTFA’s attendees to the MIP and MIP+ machines and their applications, by highlighting two customer papers, which will be presented during ISTFA 2025.

Brandon Capellini from Analog Devices‘ paper on Efficient Preparation of GaAs devices utilizing JIACO’s MIP decapsulation. This paper demonstrates the use of our MIP technology in decapsulating GaAs devices.

Nanyang Technological University Singapore‘s “Hardware Security Evaluation of Advanced Packaging” evaluates hardware security on a system-in-package (SiP) device on a printed circuit board (PCB), where Microwave Induced Plasma (MIP) etching is applied to expose the EEPROM die for signal probing to read the data in the EEPROM.