Applications
Applications of our MIP and MIP+ decapsulation machines
Discover how MIP supports your application
From advanced semiconductor packages to forensic investigation, JIACO’s MIP and MIP+ systems provide selective, controlled decapsulation for demanding applications. Open a section below to explore the requirements, capabilities and related publications for each application area.
Zero-ppm failures are driving an increased requirement to find the true root cause of failure in an efficient and systematic manner, supporting both customer returns and production problems. Reliable IC decapsulation is a prerequisite for ensuring that original failure sites are preserved, requiring:
- No process-induced damage
- Preservation of device electrical functionality
- Preservation of original failure sites
- Preservation of bond wires (Cu, Ag, PCC and Au)
- Localized CF4-free MIP decapsulation without damage
- The ability to handle advanced packages
- Clean removal of high-Tg mold compound
Learn more about our automotive decapsulation solutions in these papers
Consumer and communication electronics are rapidly evolving. As packaging technologies and materials continue to change to meet consumer demands, reliability testing and failure analysis requirements are increasing due to:
- IC packages becoming smaller and increasingly complex, including SiP, 3D packaging and WLCSP
- The shift from wire-bonded to non-wire packages, including WLCSP, TSVs and 3D stacked dies
- Bond-wire material changes driven by increasing prices, including the shift from Au to Cu and Ag
- New manufacturing technologies and materials, including GaAs and SAW/BAW filters
- Rising reliability requirements, including no process-induced damage, preservation of electrical functionality and preservation of original failure sites
Learn more about our consumer and communication decapsulation solutions in these papers
When preparing samples for failure analysis, traditional decapsulation methods are no longer suitable and can jeopardize subsequent analysis steps. Acid decapsulation can destroy the original failure site and introduce external artefacts, making sample analysis unreliable. CF4-based plasma decapsulation systems can also risk fluorine over-etching of silicon and silicon nitride passivation.
JIACO Instruments MIP decapsulation:
- Preserves original failure sites, including contamination, corrosion and migration
- Does not introduce external artefacts
- Enables reliable sample analysis
- Gets it right the first time
Learn more about our failure analysis decapsulation solutions in these papers
Devices used in the complex aerospace and defence industry must provide complete reliability over long service lives, while withstanding extreme conditions such as temperature, pressure and wear. Reliable and repeatable IC decapsulation is therefore essential for accurate analysis and reliability testing, requiring:
- No process-induced damage
- Preservation of device electrical functionality
- Preservation of original failure sites
- Preservation of bond wires (Cu, Ag, PCC and Au)
- Localized decapsulation
- The ability to handle advanced packages
- Clean removal of high-Tg mold compound
Learn more about our aerospace and defence decapsulation solutions in these papers
The JIACO Instruments MIP system enables reliable sample preparation of advanced packages used in high-performance computing. The MIP system has proven capable of etching underfill materials while preserving structures in stacked-die packages, including 2.5D and 3D packages, chiplets and microbumps.
The high selectivity enabled by the CF4-free plasma used in MIP decapsulation supports reliable sample analysis while preserving the structures and materials required for accurate failure analysis.
Learn more about our high-performance computing decapsulation solutions in these papers
Accessing and extracting critical data from ICs under investigation is becoming increasingly complex due to changing materials, smaller packages and more highly integrated designs. Reliable IC decapsulation is a prerequisite for forensic investigation, requiring:
- No process-induced damage
- Preservation of device electrical functionality
- Preservation of data stored in memory
- Localized decapsulation
- The ability to handle advanced packages such as SiP and 3D stacked dies
Learn more about our cybersecurity decapsulation solutions in these papers
Our Microwave Induced Plasma (MIP) Systems
Semiconductor Decapsulation For Failure Analysis
Get it right the first time
Why plasma over acid decapsulation?
Discover the new industry standard for semiconductor failure analysis.