MIP: Supporting you in your transition from Au bond wires

Where gold can withstand acid decapsulation, substitute materials such as Ag or Cu are at a much greater risk of damage. With a market demanding more sophisticated results, acid decapsulation is not sufficient to meet the requirements anymore. 

JIACO Instruments MIP technology will support your quality requirements as transition to alternatives. Our highly selective MIP decapsulation technique is a proven way to decapsulate your samples without introducing artifacts, preserving the wire bonds with our damage and the original failure site.  

Lear more about our proven solutions, including our patented Ag decapsualtion process, in our published papers such as  

https://jiaco-instruments.com/ipfa-2016/ 
https://jiaco-instruments.com/istfa-2018/ 
https://jiaco-instruments.com/istfa-2019/ 

Or download our whitepaper 
https://knowledge.jiaco-instruments.com/whitepaper-semiconductor-decapsulation-for-failure-analysis 

Why plasma over acid decapsulation?

Discover the new industry standard for semiconductor failure analysis

Download our whitepaper