𝗝𝗜𝗔𝗖𝗢 𝗜𝗻𝘀𝘁𝗿𝘂𝗺𝗲𝗻𝘁𝘀’ 𝗜𝗦𝗧𝗙𝗔 𝟮𝟬𝟮𝟱 𝗿𝗲𝗰𝗮𝗽

The JIACO Instruments sales & applications teams have returned from a busy and insightful ISTFA 2025 where we met with many existing & potential customers on how we can support their localised decapsulation & etching challenges.

This year ISTFA focused on advanced packaging, with the AMD keynote underlining a key trend in the growth in size of HPC packaging. During the conference, discussions on challenges with HPC’s were the focus, but we also spoke with a wide variety of end user industries such as automotive, memory and power devices, all of whom face their own set of decapsulation challenges.

After debuting at ISTFA 2024, there was growing interest in localised etching of Si, SiO₂ and related materials using the MIP+ machine. We look forward to demonstrating MIP+’s capabilities in the coming months.

Thanks to everyone who visited us and shared their insights and challenges with us!

We look forward to continuing helping support our customers with what comes next.

𝘞𝘢𝘯𝘵 𝘵𝘰 𝘬𝘯𝘰𝘸 𝘮𝘰𝘳𝘦 𝘢𝘣𝘰𝘶𝘵 𝘩𝘰𝘸 𝘸𝘦 𝘤𝘢𝘯 𝘩𝘦𝘭𝘱 𝘴𝘶𝘱𝘱𝘰𝘳𝘵 𝘺𝘰𝘶𝘳 𝘥𝘦𝘤𝘢𝘱𝘴𝘶𝘭𝘢𝘵𝘪𝘰𝘯 needs?
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