- March 22 - 26, 2026 | Tuscon, AZ
Microelectronics Reliability at IRPS 2026
IEEE International Reliability Physics Symposium
IRPS 2026 took place from March 22 to 26 at the Loews Ventana Canyon Resort in Tucson, Arizona.
The conference brought together engineers and scientists from around the world to present new research in microelectronics reliability. The technical program covered semiconductor devices, integrated circuits and microelectronic assemblies, connecting the physics of failure with real application environments.
IRPS also provided a focused setting for technical learning and exchange between reliability specialists working across industry, research and academia.
Why IRPS Matters to JIACO Instruments
Reliability Testing Meets Failure Analysis
IRPS connects reliability physics with failure analysis, product reliability and qualification testing. These areas depend on sample preparation that provides access to the device without changing the evidence being investigated.
New Packaging Creates New Access Challenges
The 2026 program addressed heterogeneous integration, 2.5D/3D packages, chiplets and hybrid bonding. Investigating these structures requires controlled access to underfill, µbumps and other buried interfaces supported by MIP and MIP+ workflows.
Preserving the Original Failure Evidence
Reliable conclusions require samples to remain representative of the original device. JIACO’s MIP approach is designed to preserve failure sites, bond wires and critical structures while avoiding process-induced artifacts during decapsulation.
Let's Continue the Conversation
Thank you for visiting JIACO Instruments. Whether we met at a conference, exhibition, workshop or technical presentation, we look forward to continuing the conversation.
Our team supports engineers, researchers and failure analysis specialists with advanced semiconductor sample preparation, controlled material removal and access to critical structures.