- Oct 4 - 8 | San Antonio, Texas | Booth 525
Meet JIACO at EPTC 2026
28th Electronics Packaging Technology Conference
JIACO Instruments will be attending EPTC 2026 from December 1–4 at the Sands Expo & Convention Centre in Singapore.
Meet the JIACO team to discuss the latest developments in Microwave Induced Plasma technology and discover how MIP and MIP+ support reliable decapsulation, advanced package etching and semiconductor failure analysis.
Program highlights
EPTC 2026 in Singapore
Join the 28th Electronics Packaging Technology Conference from December 1–4, 2026, in Singapore.
Explore the technical program
Discover research and industry developments across advanced packaging, materials, manufacturing, interconnection technologies and reliability.
Meet JIACO at EPTC 2026
Connect with the JIACO team to discuss MIP and MIP+ technology for IC decapsulation, advanced package etching and semiconductor failure analysis.
Plan your visit
EPTC 2026 will take place at the Sands Expo & Convention Centre, 10 Bayfront Avenue, Singapore. Contact us to arrange a meeting with the JIACO team.
Why EPTC matters to JIACO Instruments
EPTC brings together researchers, manufacturers and industry specialists working in advanced semiconductor packaging, materials, interconnect technologies, manufacturing and reliability.
These areas are closely connected to JIACO’s work. As packages become more integrated and complex, reliable failure analysis requires controlled material removal without damaging the structures being investigated. EPTC provides an opportunity to demonstrate how MIP and MIP+ support IC decapsulation, advanced package etching and sample preparation for accurate failure analysis.
Meet us at EPTC 2026
Attending EPTC 2026? Meet the JIACO team to discuss how Microwave Induced Plasma technology supports selective IC decapsulation, advanced package etching and controlled sample preparation for reliable semiconductor failure analysis.