- May 19–20, 2026 | Halle, Germany | Presenting
Advancing Sample Preparation for 2.5D/3D Packages
JIACO Instruments participated in the 13th CAM Workshop in Halle, Germany, which brought together specialists working in failure analysis and material diagnostics for electronic components.
During the technical program, Jiaqi Tang presented:
The presentation demonstrated how localized Microwave-Induced Plasma etching can support controlled access to regions of interest across package-, die- and board-level failure analysis workflows.
Applications Presented at CAM Workshop 2026
Application Areas
Automotive
- High-Tg mold compound
- Modules
- Cu wire
- BOAC
- AEC-Q100/Q006 qualification
Aerospace & Communication
- Radiation testing
- Die extraction
- PCB/COB
- CSP
- SAW/BAW filters
- GaAs, GaN and SiC
- Ag wire
- SiP
High-Performance Computing
- 2.5D and 3D packages
- Chiplets
- µbumps
- Redistribution layers
Failure Analysis
- Contamination
- Corrosion
- Passivation and die cracks
- Migration
- Electrical overstress
2.5D/3D Case Studies Discussed
Top-Down Failure Analysis of an Interposer Die
Localized overmold removal to provide access for EBAC while preserving the interposer metallization and laminate.
Bottom-Up Localized µbump Opening
Selective underfill removal at the package-substrate, interposer and GPU-die interfaces.
Bottom-Up Failure Analysis of a Processor Die
Mechanical grinding followed by MIP underfill removal to reduce the risk of overgrinding and losing the defect.
Cross-Section µbump Analysis
Controlled underfill removal to expose long µbump chains for bump-shape, metallurgy and contact-integrity analysis.
Looking Back at CAM Workshop 2026
CAM Workshop provided a focused setting for exchanging technical insights with specialists working on increasingly complex failure analysis and sample preparation challenges.
For JIACO Instruments, the workshop provided an opportunity to demonstrate how MIP and MIP+ technologies can support controlled material removal across advanced packages, semiconductor devices and board-level assemblies.
The applications presented showed how sample preparation can be adapted to the material stack, region of interest and analytical requirements of each sample.
Let's Continue the Conversation
Thank you for visiting JIACO Instruments. Whether we met at a conference, exhibition, workshop or technical presentation, we look forward to continuing the conversation.
Our team supports engineers, researchers and failure analysis specialists with advanced semiconductor sample preparation, controlled material removal and access to critical structures.