JIACO Instruments will be presenting at the CAM Workshop, the workshop concentrating on failure analysis and material diagnostics of electronics components in Halle, Germany
On May 19th, our colleague Jiaqi Tang will give a presentation during the workshop entitled “Microwave Induced Plasma Etching for 2.5D/3D Advanced Package Sample Preparation”.
This presentation will discuss the application of Microwave Induced Plasma (MIP) in sample preparation workflows, where localized MIP etching is applied from top-down, bottom-up, and cross-sectional approaches. Package-level case studies will cover underfill removal to expose μbump and dies in CoWoS packages, and polyimide removal to expose copper RDL in InFO packages. Latest developments on MIP+ etching for die-level and board-level sample preparation will cover selective Si removal for backside access to Si die, GaN-on-Si die, and bridge die for fault isolation, as well as silicone sealant removal to access components on PCB board and flex cable.
You can register for CAM Workshop here: https://cam-workshop.de/registration/
We look forward to seeing you in Halle!
