Abstract
Bonding failures are a common source of abnormal electrical signals in failing devices. While major defects are easily identifiable, detecting subtle wire bond failures remains challenging. Identifying these minor defects often requires a tedious investigation. This work demonstrates using JIACO Microwave Induced Plasma (MIP) to reveal subtle bonding failures that go undetected in curve trace analysis. By correlating discolored bond wires with lifted ball bonds through optical imaging, all lifted ball bonds can be identified more efficiently, thereby accelerating root cause investigation. A post-decapsulation analysis of a case study is presented, along with a theoretical explanation of the detecting method.
Charles Odegard (Texas Instruments, Inc. Dallas, USA), Daniel Scott (Texas Instruments, Inc. Dallas, USA), Olivia Bonin (Texas Instruments, Inc. Dallas, USA), Yashan Peng (JIACO Instruments. Delft, The Netherlands), Jiaqi Tang (JIACO Instruments. Delft, The Netherlands), Mark McKinnon (JIACO Instruments. Delft, The Netherlands), Kees Beenakker (JIACO Instruments. Delft, The Netherlands)
