GlobalFoundries have recently published an article with a title “Methods to Enable Fault Isolation on 2.5D Molded Interposer Packages”. This publication is available in November issue of digital Electronic Devices Failure Analysis (EDFA) Magazine (Volume 23, No. 4).
This article discusses the failure analysis challenges posed by large overmolded 2.5D packages, and introduces decapsulation technology by JIACO Instruments as a solution for overmold removal, as well as techniques to handle large packages for EBAC analysis. This is yet another case study where our machine proved its capability in failure analysis of complex 2.5D packages. Localized MIP etching enabled fault isolation without causing damage of modules. Moreover, MIP decapsulation did not require disassembly of modules, which gives a fgreat advantage over traditional plasma decapsulation techniques.
Read the full article via link: https://static.asminternational.org/edfa/202111/14/
