- May 26–29, 2026 | Orlando, Florida | Booth 122
Sample Preparation for Advanced Packaging
JIACO Instruments attended ECTC 2026 and exhibited at Booth 122, where the focus was on sample preparation for next-generation packaging.
Advanced packaging technologies, including 2.5D and 3D architectures, integrate multiple dies and components into increasingly complex packages. As these structures evolve, failure analysis and sample preparation methods must also adapt.
Why ECTC Matters to JIACO Instruments
Advanced Packaging at the Center
ECTC’s technical program covered advanced packaging, interconnections, materials and processing, and applied reliability. These topics are directly relevant to JIACO’s work on controlled access to 2.5D and 3D package structures for failure analysis.
MIP in a 3D Module Case Study
A Texas Instruments paper presented at ECTC 2026 used MIP decapsulation during the investigation of a damaged 3D multi-chip module. Removing mold compound exposed the die sidewall, helping reveal cracking and support the final root-cause conclusion.
Direct Exchange with the Packaging Community
ECTC brought together packaging engineers, foundries, OSATs, equipment suppliers and researchers. At Booth 122, JIACO discussed how sample-preparation workflows must adapt as next-generation packages integrate more dies, materials and interfaces.
Looking Back at ECTC 2026
Visitors could meet the JIACO Instruments team at Booth 122 to discuss sample preparation requirements for next-generation packaging. At ECTC 2026, JIACO Instruments presented its focus on sample preparation for complex 2.5D and 3D package architectures.
Let's Continue the Conversation
Thank you for visiting JIACO Instruments. Whether we met at a conference, exhibition, workshop or technical presentation, we look forward to continuing the conversation.
Our team supports engineers, researchers and failure analysis specialists with advanced semiconductor sample preparation, controlled material removal and access to critical structures.