Abstract
Decapsulation of System-in-Package (SiP) modules is a tremendous challenge in failure analysis due to the increasing complexity of SiP. A wide spectrum of materials and packaging structures like stacked-die, CSP, PoP can be integrated in the same module. Failure sites like EOS, contamination, corrosion may appear on any of the components in an SiP. The capability to expose and preserve all the components as well as original failure sites is the key to ensure a high success rate in SiP failure analysis. This paper presents the latest developments of a halogen-free Microwave Induced Plasma (MIP) instrument as a unique tool that provides the capability to preserve original failures in most complex SiP and 3D structures.
J. Tang (JIACO Instruments. Delft, The Netherlands), J. Wang (JIACO Instruments. Delft, The Netherlands), St.J. Dixon-Warren (TechInsights Inc. Canada), C.I.M Beenakker (Delft University of Technology. Delft)
