ISTFA 2019 – Silver Wire Ball Bond and Stitch Bond – MIP Decapsulation – JIACO Instruments
Together with our customer Hirex Engineering during ISTFA 2019, Dr. Jiaqi Tang presented JIACO Instruments patent-pending Ag silver wire plasma decapsulation process. The paper entitled ‘Artifact-Free Decapsulation of Silver Wire Bonded Semiconductor Devices Using Microwave Induced Plasma.’
Decapsulation of silver wire bonded packages with known techniques often result in damaged silver wires. The chemical properties of silver and silver compounds make silver bond wire inherently susceptible to etching damage by acid, conventional plasma, and oxygen-based Microwave Induced Plasma (MIP). In this paper, we solved this problem by developing specific decapsulation chemistry, based on a hydrogen-containing atmospheric pressure MIP, for artifact-free decapsulation of silver wire bonded packages.
We welcome you to contact us to speak about how MIP can solve your decapsulation challenges, including Ag bond wire.
