News

Team JIACO Instruments recently visited the DIFFER facility in Eindhoven as part of our ongoing collaboration. We kicked off the day with a productive team meeting reflecting on the year so far and making exciting plans for the future. Xingyu Chen then gave us an inspiring tour of the facility where we collaborate on fundamental plasma research. The

Semiconductor decapsulation has always been done with acid. But semiconductors are changing: they’re more delicate, more complex, more powerful. And decapsulation methods have to adapt — or risk rendering samples useless by wiping out the evidence at failure sites.   The reality is, acid isn’t fit for purpose anymore. It’s not selective or refined enough to give your

Semiconductor decapsulation is an increasingly challenging, delicate and time-pressured process. Acid has been the go-to for all labs — but it’s no longer a future-proof approach. The market is demanding more nuanced results than traditional acid decapsulation can deliver.   Here, we’ll explore the trends combining to knock acid decapsulation off its dominant spot.   More IOs

JEDEC has recently updated the standard on wire bond pull test methods (JESD22-B120), adding guidance in Annex B for performing decapsulation on devices prior to bond pull testing. JESD22-B120 test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package

Work recently published in Microelectronics Reliability 137 (2022), 114766, describes extensive failure analysis process, developed to localize and analyze in details aluminium corrosion in IGBT modules. Investigation of this failure mechanism, common in harsh environments, has been essentially enabled by Microwave Induced Plasma (MIP) decapsulation technique. MIP selectively removed the passivation material in studied IGBT

GlobalFoundries have recently published an article with a title “Methods to Enable Fault Isolation on 2.5D Molded Interposer Packages”. This publication is available in November issue of digital Electronic Devices Failure Analysis (EDFA) Magazine (Volume 23, No. 4). This article discusses the failure analysis challenges posed by large overmolded 2.5D packages, and introduces decapsulation technology