News

Browse our latest updates

JIACO Instruments team visiting DIFFER

π—π—œπ—”π—–π—’ π—œπ—»π˜€π˜π—Ώπ˜‚π—Ίπ—²π—»π˜π˜€ π˜ƒπ—Άπ˜€π—Άπ˜π˜€ π——π—œπ—™π—™π—˜π—₯ 𝗢𝗻 π—˜π—Άπ—»π—±π—΅π—Όπ˜ƒπ—²π—»!

Team JIACO Instruments recently visited the DIFFER facility in Eindhoven as part of our ongoing collaboration. We kicked off the day with a productive team meeting reflecting on the year so far and making exciting plans for the future. Xingyu Chen then gave us an inspiring tour of the facility where we collaborate on fundamental plasma research. The

Read More
Engineer using a JIACO Instruments MIP Decapsulation machine.

5 reasons why every failure analysis team needs a MIP decapsulation machine

Semiconductor decapsulation has always been done with acid. But semiconductors are changing: they’re more delicate, more complex, more powerful. And decapsulation methods have to adapt β€” or risk rendering samples useless by wiping out the evidence at failure sites.   The reality is, acid isn’t fit for purpose anymore. It’s not selective or refined enough to give your

Read More
Image showing a ball joint

Market trends affecting Semiconductor decapsulation

Semiconductor decapsulation is an increasingly challenging, delicate and time-pressured process. Acid has been the go-to for all labs β€” but it’s no longer a future-proof approach. The market is demanding more nuanced results than traditional acid decapsulation can deliver.   Here, we’ll explore the trends combining to knock acid decapsulation off its dominant spot.   More IOs

Read More
Image showing the news article

New publication – MIP decapsulation enabling failure analysis of IGBT modules

Work recently published in Microelectronics Reliability 137 (2022), 114766, describes extensive failure analysis process, developed to localize and analyze in details aluminium corrosion in IGBT modules. Investigation of this failure mechanism, common in harsh environments, has been essentially enabled by Microwave Induced Plasma (MIP) decapsulation technique. MIP selectively removed the passivation material in studied IGBT

Read More
EDFA magazine november 2021

EDFA Magazine article on Microwave Induced Plasma (MIP) removal of interposer overmold in 2.5D packages

GlobalFoundries have recently published an article with a title β€œMethods to Enable Fault Isolation on 2.5D Molded Interposer Packages”. This publication is available in November issue of digital Electronic Devices Failure Analysis (EDFA) Magazine (Volume 23, No. 4). This article discusses the failure analysis challenges posed by large overmolded 2.5D packages, and introduces decapsulation technology

Read More

Download our whitepaper