Semiconductor decapsulation is an increasingly challenging, delicate and time-pressured process. Acid has been the go-to for all labs — but it’s no longer a future-proof approach. The market is demanding more nuanced results than traditional acid decapsulation can deliver. Here, we’ll explore the trends combining to knock acid decapsulation off its dominant spot. More IOs
JEDEC has recently updated the standard on wire bond pull test methods (JESD22-B120), adding guidance in Annex B for performing decapsulation on devices prior to bond pull testing. JESD22-B120 test method provides a means for determining the strength and failure mode of a wire bonded to, and the corresponding interconnects on, a die or package
Work recently published in Microelectronics Reliability 137 (2022), 114766, describes extensive failure analysis process, developed to localize and analyze in details aluminium corrosion in IGBT modules. Investigation of this failure mechanism, common in harsh environments, has been essentially enabled by Microwave Induced Plasma (MIP) decapsulation technique. MIP selectively removed the passivation material in studied IGBT
GlobalFoundries have recently published an article with a title “Methods to Enable Fault Isolation on 2.5D Molded Interposer Packages”. This publication is available in November issue of digital Electronic Devices Failure Analysis (EDFA) Magazine (Volume 23, No. 4). This article discusses the failure analysis challenges posed by large overmolded 2.5D packages, and introduces decapsulation technology
The Europe-wide research initiative Intelligent Reliability 4.0 (iRel40) has a goal to improve the reliability of electronic systems and microelectronic components. Coordinated by Infineon Technologies AG, 75 science and industry partners from 13 countries are uniting their forces to achieve this goal. iRel40 aims to find solutions to cope with the ever increasing complexity of
Our article “Enabling True Root Cause Failure Analysis Using an Atmospheric Oxygen-Only Plasma for Decapsulation of Advanced Packages” is now available in digital edition of EDFA Magazine (Volume 23, Issue 1). Case studies presented in this article show that the success rate of preserving the material which causes failure mechanisms can be greatly improved by
