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RADNEXT 2026: JIACO Instruments presented on the use of MIP for radiation testing

JIACO Instruments presented at RADNEXT Workshop 2026 in Rome, where Ya-Shan Peng discussed the use of Microwave Induced Plasma (MIP) etching for artifact-free semiconductor decapsulation in radiation testing.

May 6, 2026

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6 - 7 May, 2026 | Rome, Italy | Presenter & Exhibitor

Artifact-Free Decapsulation for Radiation Testing

JIACO Instruments participated as a presenter and exhibitor at the G-RADNEXT Workshop 2026, held on May 6 and 7 at Villa Mondragone in Frascati, near Rome, Italy.

During the technical program, Ya-Shan Peng presented:

“Artifact-Free Decapsulation: Using Highly Selective Microwave Induced Plasma Etching”

The presentation demonstrated how atmospheric-pressure MIP uses neutral, halogen-free radical species to selectively remove encapsulation material while preserving die surfaces, metal wires and device electrical functionality. This provides reliable front-side access for subsequent Single Event Effect (SEE) characterization.

Presentation overview

What Was Presented at RADNEXT 2026

Preserving the Original Device

Accurate Single Event Effect characterization depends on the sample retaining its original electrical behavior and structural condition after package removal.

Risks in Conventional Decapsulation

High-Tg mold compounds, Cu and Ag wires, and PCB-based devices can be difficult to prepare. Acid etching can thin wires or corrode pads, while CF₄-based vacuum plasma can over-etch die surfaces and introduce ion-bombardment damage.

Highly Selective Atmospheric-Pressure MIP

The presentation explained how neutral, halogen-free radical species selectively remove encapsulation material without ion bombardment, preserving die surfaces and metal wires.

Reliable Access for SEE Testing

By maintaining device functionality and avoiding preparation-induced variation, MIP provides front-side access while helping ensure that subsequent SEE results reflect the device itself.

Workshop recap

Looking Back at RADNEXT Workshop 2026

RADNEXT Workshop 2026 provided a focused setting for discussing the sample-preparation requirements behind reliable radiation testing and Single Event Effects characterization.

Ya-Shan Peng presented how highly selective, atmospheric-pressure Microwave Induced Plasma etching can remove encapsulation material while preserving die surfaces, metal wires and device functionality.

For JIACO Instruments, the workshop connected artifact-free decapsulation with the practical need to prevent preparation-induced damage from influencing subsequent radiation-test results.

To learn more about MIP for radiation-testing sample preparation or discuss a related device challenge, contact the JIACO team at info@jiaco-instruments.com .

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Thank you for visiting JIACO Instruments. Whether we met at a conference, exhibition, workshop or technical presentation, we look forward to continuing the conversation.

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