- 6 - 7 May, 2026 | Rome, Italy | Presenter & Exhibitor
JIACO Instruments was proud to participate in the RADNEXT Workshop 2026, where Ya-Shan Peng presented the latest advances in Microwave Induced Plasma (MIP) etching for artifact-free semiconductor decapsulation in radiation testing applications.
The presentation, “Artifact-Free Decapsulation Using Highly Selective Microwave Induced Plasma Etching”, demonstrated how atmospheric-pressure MIP technology provides a highly selective alternative to conventional decapsulation methods. By utilizing neutral, halogen-free radical species, MIP enables precise removal of encapsulation materials while preserving critical device structures, including die surfaces and bond wires.
As radiation testing and Single Event Effects (SEE) characterization require uncompromised device integrity, maintaining the original electrical behavior of the semiconductor after decapsulation is essential. Unlike methods that rely on ion bombardment or aggressive chemical processes, MIP technology minimizes the risk of structural damage and allows reliable front-side access to devices without introducing artifacts that could influence subsequent test results.
The workshop presentation highlighted how MIP technology supports high-quality sample preparation for radiation testing laboratories, semiconductor manufacturers, research institutes, and failure analysis specialists seeking non-destructive and reproducible decapsulation solutions.
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Our team supports engineers, researchers, and failure analysis specialists with advanced semiconductor sample preparation, controlled material removal, and access to critical structures.
