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Be sure to catch JIACO Instruments presenting & exhibiting in May

During May, you will have the opportunity to learn from JIACO Instruments at several leading conferences and exhibitions we will be attending. Be sure to note the following presentation dates during these conferences to discover our latest applications and solutions: RadNext Workshop – held in Rome, ItalyOn May 6th, our colleague Yashan Peng-Shan Peng will

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Detecting subtle wire bond defects with MIP decapsulation

Undetected wire bond defects can lead to intermittent faults or premature device failure, even when samples pass electrical curve trace analysis. JIACO Instruments’ MIP decapsulation offers a faster way to uncover these subtle issues, as minor bonding defects become visible through simple optical inspection. In a recent case study, an electrically failing PCC sample revealed oxidised, rough-surfaced defective bonds after MIP processing—providing clear visual evidence that traditional decapsulation methods can miss.

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Passivation crack SiC High Tg Mold compound after MIP decap

Manuscript featuring MIP selected as an Editor’s Choice article for2025 from the Journal of Failure Analysis and Prevention.

Congratulations to Mr. Sorrells, Mr. Nielsen, Mr. Walters of Microchip Technology and Dr. Tang, and Mr. McKinnon of JIACO Instruments, who have received confirmation that their manuscript “Optimizations and Case Studies: Decapsulation of Hardened Epoxy SiC MOSFETs and Diodes via JIACO Microwave-Induced Plasma Etching” was selected as an Editor’s Choice article for 2025 from the

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Enabling preservation and full exposure of EOS failure sites by MIP

Electrical overstress (EOS) occurs when the voltage, current, or power in the device exceeds some maximal limit, inducing thermal damage in the device. This is one of the most common types of electrical failures, found in all stages of the IC device life cycle. Determining the root cause of EOS is integral to prevent future failures, but due to the thermal stress, the failure

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𝗛𝗶𝗴𝗵 𝗧𝗴 𝗲𝗽𝗼𝘅𝘆 𝗺𝗼𝗹𝗱 𝗰𝗼𝗺𝗽𝗼𝘂𝗻𝗱𝘀 𝗮𝗿𝗲 𝘄𝗶𝗱𝗲𝗹𝘆 𝘂𝘀𝗲𝗱 𝗳𝗼𝗿 𝗵𝗶𝗴𝗵-𝘁𝗲𝗺𝗽𝗲𝗿𝗮𝘁𝘂𝗿𝗲 𝗮𝗽𝗽𝗹𝗶𝗰𝗮𝘁𝗶𝗼𝗻𝘀 𝘀𝘂𝗰𝗵 𝗮𝘀 𝗮𝘂𝘁𝗼𝗺𝗼𝘁𝗶𝘃𝗲 𝗲𝗹𝗲𝗰𝘁𝗿𝗼𝗻𝗶𝗰𝘀.

A known challenge is preserving copper bond wires during decapsulation, as conventional acid processes can damage the wires. This becomes even more critical when silver-plated leadframes are used, since acid and conventional plasma etching readily attack silver and make stitch bond exposure difficult. This work, by Sumitomo Bakelite, presents a decapsulation process based on Microwave

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Looking back on 2025 and happy holidays!  

2025 has been a meaningful year for JIACO Instruments in many ways.  We commemorate the passing of our co-founder, Prof. Kees Beenakker. His pioneering work and the inspiration he shared with colleagues continue to shape the MIP and guide JIACO Instruments into the future.  We’re proud of our achievements in 2025, including: – Plenary talk by Prof. Kees Beenakker at ICEPT 2025  –

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