During May, you will have the opportunity to learn from JIACO Instruments at several leading conferences and exhibitions we will be attending. Be sure to note the following presentation dates during these conferences to discover our latest applications and solutions:
RadNext Workshop – held in Rome, Italy
On May 6th, our colleague Yashan Peng-Shan Peng will present at the ENEA Frascati Research Center “Artifact-Free Decapsulation Using Highly Selective Microwave Induced Plasma Etching”
CAM Workshop – held in Halle, Germany
On May 19th, our colleague Jiaqi Tang will present “Microwave Induced Plasma Etching for 2.5D/3D Advanced Package Sample Preparation”
You can also visit JIACO Instruments during the exhibition.
Electronic Components and Technology Conference (ECTC) held in Orlando, FL
This premier event brings together experts in packaging, components, and microelectronic systems. Visit JIACO Instruments at Booth 122 during the exhibition.
We look forward to meeting you at these conferences!
