Congratulations to Mr. Sorrells, Mr. Nielsen, Mr. Walters of Microchip Technology and Dr. Tang, and Mr. McKinnon of JIACO Instruments, who have received confirmation that their manuscript “Optimizations and Case Studies: Decapsulation of Hardened Epoxy SiC MOSFETs and Diodes via JIACO Microwave-Induced Plasma Etching” was selected as an Editor’s Choice article for 2025 from the Journal of Failure Analysis and Prevention.
This selection is reflective of the comprehensive nature of the paper and its overall excellence. Only six papers are selected each calendar year as an Editor’s Choice article from among all of the articles published in the Journal of Failure Analysis and Prevention for that year.
One of the foremost challenges in the field of SiC MOSFET and diode failure analysis is the effect of thermally modified mold compound on the decapsulation process. This paper focuses on use cases for the JIACO microwave-induced plasma (MIP) etching system and how to best optimize the tool’s settings to facilitate time-efficient decapsulations.
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Optimizations and Case Studies—Decapsulation of Hardened Epoxy SiC MOSFETs and Diodes via JIACO Microwave Induced Plasma Etching
Microchip Technologies, ISTFA 2024, High Tg Mold Compound, Passivation & Die Crack, SiC, Reliability Test.
Download from the Springer Nature Link: https://shorturl.at/6tHu1
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