- July 13–16, 2026 | Marina Bay Sands Convention Center, Singapore
JIACO Instruments will be attending IPFA 2026, taking place from July 13 to 16, 2026 at Marina Bay Sands in Singapore, and we look forward to discussing the latest challenges & developments in semiconductor Failure Analysis with the industry.
IPFA brings together the global failure analysis and reliability community for four days of technical presentations and knowledge sharing. For JIACO, it provides an excellent opportunity to engage with engineers and researchers working on advanced failure analysis workflows, package-level analysis, and sample preparation challenges, including advanced package decapsulation, underfill removal, backside access, and controlled silicon delayering.
As an example of how MIP+ is being applied to these challenges, AMD Singapore, Nanyang Technological University, and JIACO Instruments will present:
“High Throughput MIP+ Etching for Failure Analysis of SoIC Packages”
The paper demonstrates the use of MIP+ for selective, localized plasma etching to improve underfill removal and bulk silicon delayering workflows for advanced SoIC package failure analysis.
If you are attending IPFA and would like to discuss your current failure analysis or sample preparation challenges, we would welcome the opportunity to meet with you at Booth B4.
We look forward to seeing you in Singapore!
Read more about the paper and MIP+ applications:
High‑Throughput MIP+ Etching for Failure Analysis of SoIC Packages
By Aaron Lee, Bernice Zee, Frederick Owen Zhong, Ya-Shan Peng and Jiaqi Tang
AMD Singapore, Nanyang Technological University and JIACO Instruments
Full paper available after the IPFA 2026 conference presentation.
Attending IPFA 2026?
Contact us to connect before or during the workshop.
