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Enabling preservation and full exposure of EOS failure sites by MIP
Electrical overstress (EOS) occurs when the voltage, current, or power in the device exceeds some maximal limit, inducing thermal damage in the device. This is one of the most common types of electrical failures, found in all stages of the IC device life cycle. Determining the root cause of EOS is integral to prevent future
๐๐ถ๐ด๐ต ๐ง๐ด ๐ฒ๐ฝ๐ผ๐ ๐ ๐บ๐ผ๐น๐ฑ ๐ฐ๐ผ๐บ๐ฝ๐ผ๐๐ป๐ฑ๐ ๐ฎ๐ฟ๐ฒ ๐๐ถ๐ฑ๐ฒ๐น๐ ๐๐๐ฒ๐ฑ ๐ณ๐ผ๐ฟ ๐ต๐ถ๐ด๐ต-๐๐ฒ๐บ๐ฝ๐ฒ๐ฟ๐ฎ๐๐๐ฟ๐ฒ ๐ฎ๐ฝ๐ฝ๐น๐ถ๐ฐ๐ฎ๐๐ถ๐ผ๐ป๐ ๐๐๐ฐ๐ต ๐ฎ๐ ๐ฎ๐๐๐ผ๐บ๐ผ๐๐ถ๐๐ฒ ๐ฒ๐น๐ฒ๐ฐ๐๐ฟ๐ผ๐ป๐ถ๐ฐ๐.
A known challenge is preserving copper bond wires during decapsulation, as conventional acid processes can damage the wires. This becomes even more critical when silver-plated leadframes are used, since acid and conventional plasma etching readily attack silver and make stitch bond exposure difficult. This work, by Sumitomo Bakelite, presents a decapsulation process based on Microwave
Lookingย back on 2025ย andย happyย holidays!ย ย
2025 has been a meaningful year for JIACO Instruments in many ways.ย Weย commemorateย the passing of our co-founder, Prof. Keesย Beenakker. His pioneering work and the inspiration he shared with colleagues continue to shape the MIP and guide JIACO Instruments into the future.ย We’reย proud of our achievements in 2025, including: – Plenary talk byย Prof.ย Keesย Beenakkerย at ICEPT 2025ย –
๐ ๐๐ฃ: ๐ฃ๐ฒ๐ฟ๐ณ๐ฒ๐ฐ๐ ๐ณ๐ผ๐ฟ ๐ฟ๐ฒ๐น๐ถ๐ฎ๐ฏ๐ถ๐น๐ถ๐๐ ๐๐ฒ๐๐๐ถ๐ป๐ด
Conventional acid decapsulation is well known to damage copper wire bonds, leading to artificially low Cpk values that do not represent the original sample condition. This effect becomes more severe for wire diameters below 25 um and when high Tg mold compounds are used. Acid processes can also leave residues on the die surface, damage
๐๐๐๐๐ข ๐๐ป๐๐๐ฟ๐๐บ๐ฒ๐ป๐๐โ ๐๐ฆ๐ง๐๐ ๐ฎ๐ฌ๐ฎ๐ฑ ๐ฟ๐ฒ๐ฐ๐ฎ๐ฝ
The JIACO Instruments sales & applications teams have returned from a busy and insightful ISTFA 2025 where we met with many existing & potential customers on how we can support their localised decapsulation & etching challenges. ย This year ISTFA focused on advanced packaging, with the AMD keynote underlining a key trend in the growth
๐๐ฆ๐ง๐๐ ๐ฎ๐ฌ๐ฎ๐ฑ: ๐ง๐ผ๐ผ๐น๐ ๐ผ๐ณ ๐๐ต๐ฒ ๐ง๐ฟ๐ฎ๐ฑ๐ฒ!ย
This Monday (17th of November), our colleaguesย Sarah Zeroualiย andย Mark McKinnonย presented โThe Tools of the Tradeโ atย JIACO Instrumentsย booth (#715). They introduced ISTFAโs attendees to the MIP and MIP+ machines and their applications, by highlighting two customer papers,ย which will be presented during ISTFA 2025. Brandon Capelliniย fromย Analog Devicesโ paper on Efficient Preparation of GaAs devices utilizing JIACOโs MIP decapsulation.