Halogen-free Microwave Induced Plasma Decapsulation of System in Package Modules

Tech Insights, ISTFA 2017, SiP. SAW, BAW Filter, CSP, GaAs, Security Assessment.
Unique Failure Analysis Capabilities Enabled by the MIP Decapsulation Technique

Huawei, IPFA 2017, EOS, GaAs, SiP, Contamination, Corrosion.