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At IPFA 2023, Nanyang Technological University presented “Hardware Security Assessment through Repair of Damaged Device,” demonstrating how dies from a damaged SD card, when decapsulated using JIACO Instruments’ MIP process, could be transplanted into a new package, restoring functionality and preserving the original data.  The study compared acid vs. Laser + MIP decapsulation:  Key takeaways:  This application

Over 50% of medical devices contain electronic components, the working of these components are vital in patient care, diagnosis, and treatment. The integration of semiconductors in medical devices has revolutionized healthcare, leading to more advanced and reliable medical technologies.  The quality and reliability of these semiconductors are of utmost importance, especially when it comes to

Our Microwave-Induced Plasma (MIP) machines don’t require specialized lab facilities, making them more cost-effective than acid decapsulation.   Discover all the benefits of MIP technology by downloading our whitepaper by filling out the form below.

From the 5th – 8th of August, our colleagues Yashan Peng and Mark McKinnon were present at 2025’s edition of IPFA in Penang, Malaysia!  Yashan Peng was honored to present in the Sample Preparation for Fault Isolation User Group meeting, providing insight into how our MIP & MIP+ systems can be used for advanced package sample preparation. In her presentation

On August 6th in Shangai, China, Kees Beenakker had the honour of holding a plenary talk at ICEPT 2025.   In his plenary talk Prof. Beenakker looked back at over 40 years of semiconductor packaging, covering his experience in the industry  from joining Philips in 1974, to co-founding JIACO Instruments, together with Jiaqi Tang, in 2014, leading to the development

Removing underfill in your devices, whether they are 2.5D/3D advanced packages, flipchips etc, enables further analysis on your samples, but can be quite challenging using traditional chemical processes.As demonstrated in many of our recent papers, our MIP & MIP+ systems can etch UnderFill (UF) material in various locations on the package to expose & preserve