𝗠𝗜𝗣: 𝗘𝘁𝗰𝗵𝗶𝗻𝗴 𝘂𝗻𝗱𝗲𝗿𝗳𝗶𝗹𝗹 𝗺𝗮𝘁𝗲𝗿𝗶𝗮𝗹 𝘀𝘂𝗰𝗰𝗲𝘀𝘀𝗳𝘂𝗹𝗹𝘆!

Removing underfill in your devices, whether they are 2.5D/3D advanced packages, flipchips etc, enables further analysis on your samples, but can be quite challenging using traditional chemical processes.
As demonstrated in many of our recent papers, our MIP & MIP+ systems can etch UnderFill (UF) material in various locations on the package to expose & preserve various materials, including:

– the μbump chains in the interposer
– HBM overmold
– Solder balls
– Cu RDL

Our industry leadership in underfill etching, is due to the unique advantages of JIACO Instrument’s MIP systems:

– Atmospheric, CF₄-free plasma for decapsualtion/UF etching
– High selectivity
– No artifacts introduced to your sample

Allowing you to perform your analysis of the sample right the first time.

𝗥𝗲𝗮𝗱 𝗺𝗼𝗿𝗲 𝗮𝗯𝗼𝘂𝘁 𝗵𝗼𝘄 𝘁𝗵𝗲 𝗠𝗜𝗣 𝗵𝗮𝗻𝗱𝗹𝗲𝘀 𝘂𝗻𝗱𝗲𝗿𝗳𝗶𝗹𝗹 𝗲𝘁𝗰𝗵𝗶𝗻𝗴:
https://jiaco-instruments.com/istfa-2020/ 

https://ieeexplore.ieee.org/document/10249167 

https://www.researchgate.net/publication/348813806_Benefits_of_using_a_CF4-Free_Microwave_Induced_Plasma_MIP_Spot_Etch_Process_to_Remove_Underfill_and_Analyze_25D_Modules 

https://dl.asminternational.org/istfa/proceedings-abstract/ISTFA2024/84918/496/33010

https://www.researchgate.net/publication/385304981_Advanced_Package_Sample_Preparation_Leveraging_Precision_CNC-Based_Milling_and_Selective_Microwave_Induced_Plasma_Etching

https://www.researchgate.net/publication/385304985_FA_Challenges_and_Case_Study_Exploration_of_Multidie_Fan-Out_Wafer_Level_Packages 

https://dl.asminternational.org/edfa-tech/article-abstract/23/4/14/20627/Methods-to-Enable-Fault-Isolation-on-2-5D-Molded?redirectedFrom=fulltext 

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