At IPFA 2023, Nanyang Technological University presented “Hardware Security Assessment through Repair of Damaged Device,” demonstrating how dies from a damaged SD card, when decapsulated using JIACO Instruments’ MIP process, could be transplanted into a new package, restoring functionality and preserving the original data.
The study compared acid vs. Laser + MIP decapsulation:
- Acid methods often cause corrosion, leave residue, and risk damaging bond pads.
- Laser + MIP decapsulation provides high etch selectivity, preserving bond pad integrity and enabling clean exposure of gold stitch pads on the substrate.
Key takeaways:
- Superior bond pad preservation → supports reliable wire re-bonding.
- Complete exposure of stitch pads without residue → optimal conditions for repair.
- Restored chip-to-package functionality → enabling hardware security assessment and data recovery from otherwise lost devices.
This application enables new approaches in hardware security assessment enabled by JIACO Instruments MIP decapsulation system, by restoring function and recovering stored data, enabling hardware security assessment on the devices
Read the full paper here: https://www.researchgate.net/publication/374050766_Hardware_Security_Assessment_through_Repair_of_Damaged_Device
Curious how MIP could help your lab unlock new repair and security workflows?
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