Publications
Read up on our peer-reviewed publications
Automation in Microwave-Induced Plasma Decapsulation Verification through Machine Learning
by S.Y. Sim, Q. Liu, Z. Qiu and Prof. C.L. Gan, Nanyang Technological University
Microwave Induced Plasma Etching for Selective Organic and Silicon Deprocessing in Advanced Packaging
by Sungmin Han, Peng Li, Jiaqi Tang and Mark W McKinnon.
Intel Corporation, JIACO Instruments
High‑Throughput MIP+ Etching for Failure Analysis of SoIC Packages
By Aaron Lee, Bernice Zee, Frederick Owen Zhong, Ya-Shan Peng and Jiaqi Tang
AMD Singapore, Nanyang Technological University and JIACO Instruments
Hardware Security Evaluation of Advanced Packaging
Nanyang Technological University, ISTFA 2025, Die & Data Extraction, PCB, SiP, Cu Bond Wire.
Efficient Preparation of GaAs Devices Utilizing Microwave Induced Plasma Decapsulation
by Brandon Capellini, Analog Devices, USA
Revolutionizing IC Package Decapsulation with Microwave-Induced-Plasma (MIP) System
By Muhamad Hafiz bin Mahmud, Muhamad Hafiz bin Rasul Kalanjiam, Huey Lin Ong (Infineon Technologies), and Jiaqi Tang (JIACO Instruments)