Conventional acid decapsulation is well known to damage copper wire bonds, leading to artificially low Cpk values that do not represent the original sample condition. This effect becomes more severe for wire diameters below 25 um and when high Tg mold compounds are used. Acid processes can also leave residues on the die surface, damage the die in the presence of passivation micro cracks after thermal stress, and introduce artifacts that hinder further root cause failure analysis.
This study, written in collaboration with MASER, demonstrates the use of Microwave Induced Plasma decapsulation with the JIACO Instruments MIP system for AEC Q006 qualification. Compared to acid decapsulation, MIP provides higher and more representative Cpk values in wire bond pull testing, a clean die surface, and artifact free decapsulation that supports reliable root cause failure analysis.
MIP decapsulation is therefore a strong alternative for reliability testing and AEC Q006 qualification workflows.
Read the study here:
Improving the Wire Bond Pull Test and FA for Copper Wired Components
Eurofins Maser, AEC Workshop 2024, Cu Bond Wire, AEC Q100 & Q006 Qualification, Reliability Test.
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