During this yearโs IPFA conference we are excited to present a new paper with our customer Infineon Technologies โ๐๐ฆ๐ท๐ฐ๐ญ๐ถ๐ต๐ช๐ฐ๐ฏ๐ช๐ป๐ช๐ฏ๐จ ๐๐ ๐๐ข๐ค๐ฌ๐ข๐จ๐ฆ ๐๐ฆ๐ค๐ข๐ฑ๐ด๐ถ๐ญ๐ข๐ต๐ช๐ฐ๐ฏ ๐ธ๐ช๐ต๐ฉ ๐๐ช๐ค๐ณ๐ฐ๐ธ๐ข๐ท๐ฆ-๐๐ฏ๐ฅ๐ถ๐ค๐ฆ๐ฅ-๐๐ญ๐ข๐ด๐ฎ๐ข (๐๐๐) ๐๐บ๐ด๐ต๐ฆ๐ฎโ, demonstrating new solutions to the industries challenges with preserving the Nickel-plating layer on the lead finger for repackaging, preservation of Cu wires in Film Over Wire (FOW) stacked-die device decapsulation.
Failure analysis involves a series of steps to identify the root cause of a failed semiconductor IC. Current methods like acid or laser etching often damage these critical components. Using a Microwave Induced Plasma (MIP) system with oxygen-argon gas, this study demonstrates selective removal of organic materials while preserving metal layers. The MIP method enables continued failure analysis by maintaining sample integrity for repackaging and electrical testing.
This paper highlights some of the latest & ever growing applications & solutions enabled by the JIACO Instruments MIP decapsulation system. See the list of published papers here.
