On August 6th in Shangai, China, Kees Beenakker had the honour of holding a plenary talk at ICEPT 2025.
In his plenary talk Prof. Beenakker looked back at over 40 years of semiconductor packaging, covering his experience in the industry from joining Philips in 1974, to co-founding JIACO Instruments, together with Jiaqi Tang, in 2014, leading to the development of the MIP as a new tool for semiconductor failure analysis decapsulation. Prof. Beenakker highlighted many of the changes and challenges in the packaging industry that he saw 1st hand, which ultimately lead to the requirement for a new decapsulation process with a wide range of applications in reliability & failure analysis.
Prof. Beenakker concluded by high lightening his enjoyment from his career and that the MIP evolved from an environmentally friendly decapping method to an indispensable tool in failure analysis. But still with plenty of challenges ahead, like AI, quantum computing and photonics.
We would like to thank the team from ICEPT for this honorable invitation.
Contact us to discover how our plasma-based decapsulation technology helps solve advanced packaging challenges!
Info@jiaco-instruments.com