At the fourth annual “Hardware Reverse Engineering Workshop” (HARRIS 2026), JIACO Instruments Ya-Shan Peng delivered a compelling presentation entitled “Precision Sample Preparation of Advanced Packages Using Atmospheric Microwave-Induced Plasma for Hardware Reverse Engineering and Security Assessment.”.
With attendees from organisations across Europe and beyond, the event fostered three days of inspiring discussions, hands-on tutorials, and meaningful connections, bringing together a highly engaged global community.
During her presentation, Ya-Shan introduced the MIP process, provided comparisons with traditional decapsulation methods, and detailed case studies including SiP, PCB, and 2.5D modules. The presentation provided a clear overview for the attendees of the capabilities enabled by MIP.
If you’d like to receive a copy of Ya-Sha’s presentation, you can request it via our websites contact form or email us at [email protected] .
