- May 19–20, 2026 | Halle, Germany | Presenting
Advancing Sample Preparation for 2.5D/3D Packages
JIACO Instruments participated in the 13th CAM Workshop in Halle, Germany, bringing together specialists working in failure analysis and material diagnostics for electronic components.
During the technical programme, Jiaqi Tang presented:
“Microwave Induced Plasma Etching for 2.5D/3D Advanced Package Sample Preparation”
The presentation demonstrated how localized Microwave-Induced Plasma etching can support controlled access to regions of interest across package-, die-, and board-level failure analysis workflows.
Applications Presented at CAM Workshop 2026
Looking Back at CAM Workshop 2026
CAM Workshop provided a focused environment for exchanging technical insights with specialists working on increasingly complex failure analysis and sample preparation challenges.
For JIACO Instruments, the event was an opportunity to demonstrate how MIP and MIP+ technologies can support controlled material removal across advanced packages, semiconductor devices, and board-level assemblies.
The applications presented illustrate how the preparation method can be adapted to the material stack, region of interest, and analytical requirements of each sample.
