Advanced packaging technologies, including 2.5D and 3D architectures, are driving significant gains in performance, bandwidth, and device miniaturisation. As these designs become more complex—with multiple dies and components integrated into a single package—failure analysis methods must evolve to keep pace.
Join JIACO Instruments at Electronic Components and Technology Conference 2026 (Booth 122) to discover the latest advancements in sample preparation for next-generation packaging.
