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JIACO instruments at RADECS 2026

RADiation and its Effects on Components and Systems Conference
  • Sep 28 - Oct 2, 2026 | Prague, Czech Republic | Booth 11

Preparing for RADECS 2026

RADiation and its Effects on Components and Systems Conference

JIACO Instruments will be exhibiting at RADECS 2026, the leading European conference on radiation effects in electronics and photonics. You’ll find us at Booth 11 in the Prague Congress Centre throughout the technical session and industrial exhibition.

Stop by to see how our Microwave Induced Plasma (MIP) technology supports sample preparation for radiation testing, and to talk through your failure analysis challenges with our team.

Programme Highlights

Visit Us at Booth 11

Meet the JIACO team at the Prague Congress Centre exhibition floor throughout the conference.

MIP for Radiation-Test Prep

Talk to us about how MIP decapsulation supports sample preparation for radiation effects testing and failure analysis.

See MIP in Action

Ask us about demonstrations and how MIP decapsulation compares to traditional acid-based methods.

Open Exhibition Day

Attendees can visit the exhibition floor on Wednesday, 30 September, without full conference registration.

Why RADECS Matters to JIACO Instruments

RADECS brings together the scientists and engineers who study how radiation affects electronic components and systems, a field where reliable, non-destructive sample preparation is critical. As the technology recognized in the JEDEC JESD22-B120 standard, MIP gives radiation-test teams a way to prepare samples without introducing the damage or artifacts common to acid-based decapsulation.

Meet us at RADECS 2026

Attending RADECS 2026? Visit us at Booth 11 to see how Microwave-Induced Plasma technology is designed to preserve failure sites and material integrity during sample preparation for radiation-effects testing.

Get in Touch! Explore MIP Technology
Explore our publications:
Analog Devices, ISTFA 2025, GaAs.
Analog Devices, ISTFA 2025, GaAs.
Efficient Preparation of GaAs Devices Utilizing Microwave Induced Plasma Decapsulation
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AMD, ISTFA 2024, RDL, 2.5D, 3D, Chiplet.

FA Challenges and Case Study Exploration of Multidie Fan-Out Wafer Level Packages

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Texas Instruments, ECTC 2025, Cu Bond Wire, Reliability Test.

Accelerating Root Cause Identification of Subtle Bonding Failures Using MIP

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Nanyang Technological University, ISTFA 2025, Die & Data Extraction, PCB, SiP, Cu Bond Wire.

Hardware Security Evaluation of Advanced Packaging

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Infineon, IPFA 2025, Cu Bond Wire, Repackaging.

Revolutionizing IC Package Decapsulation with Microwave-Induced-Plasma (MIP) System

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Altera, IPFA 2025, RDL, CSP.

Polyimide removal approach on redistribution layer of WLCSP package using Microwave Induced Plasma

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University of Florida, PAINE 2024, 2.5D, 3D, Chiplet, Security Assessment.

Physical Security Assessment of Advanced Packaging Structures

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GlobalFoundries, ISTFA 2024, GaN, Migration & Bridging.

Removal of Highly Doped Silicon for Backside Fault Isolation with Fluorine-Based Etches

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NVIDIA, ISTFA 2024, 2.5D, 3D, μbump.

Advanced Package Sample Preparation Leveraging Precision CNC-Based Milling and Selective Microwave Induced Plasma Etching

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