- 24 – 25 March 2026 | Bochum, Germany | Presenter & Exhibitor
Advancing Sample Preparation for Radiation Effects Analysis
The 4th Hardware Reverse Engineering Workshop (HARRIS 2026) brought together researchers, engineers, government organizations and industry professionals focused on hardware reverse engineering and semiconductor security.
As a sponsor, exhibitor and presenter, JIACO Instruments engaged with attendees throughout the event while contributing to the technical program through a presentation delivered by Ya-Shan Peng.
The presentation, “Precision Sample Preparation of Advanced Packages Using Atmospheric Microwave-Induced Plasma for Hardware Reverse Engineering and Security Assessment,” explored how controlled plasma decapsulation can help expose critical structures within advanced semiconductor packages.
Looking Back at HARRIS 2026
HARRIS 2026 provided valuable opportunities to connect with the hardware reverse engineering community and discuss the challenges associated with analyzing increasingly complex semiconductor devices.
Throughout the event, JIACO Instruments engaged with attendees, shared application expertise and delivered a technical presentation on atmospheric Microwave-Induced Plasma technology. The conference also led to follow-up discussions with organizations interested in advanced sample preparation solutions.
Let's Continue the Conversation
Thank you for visiting JIACO Instruments. Whether we met at a conference, exhibition, workshop or technical presentation, we look forward to continuing the conversation.
Our team supports engineers, researchers and failure analysis specialists with advanced semiconductor sample preparation, controlled material removal and access to critical structures.