Why this paper matters
At ECTC 2026, Charles Odegard from Texas Instruments will present the paper “Methodology for Root Cause Analysis of 3D Multi-Chip Module Severely Damaged in Data Center Application.”
The paper focuses on the root cause analysis of a severely degraded customer-returned 3D multi-chip module used in a data center application. The investigation follows a structured FA workflow, including circuit analysis, IR microscopy, 3D X-ray, P-FIB, decapsulation and SEM imaging.
Abstract excerpt
“The methodical application of electrical and physical falt isolation techniques enabled identification of the failure mechanism for a severely damaged 3D module. This study outlines the thought process and findings at each step of the analysis whch lead to root cause identification for electrically induced physical damage (EIPD). Evidence collected at each step led to deliberate selection of the subsequent state-of-the-art fault isolation techniques that finally resulted in root cause determination of failure. The root cause of failure was found to be a defect introduced during the wafer saw process“
– by Charles Odegard et al., Texas Instruments Inc
Role of MIP decapsulation
In the final stage of the investigation, Microwave-Induced Plasma (MIP) decapsulation was used to remove mold compound and expose the die sidewall, helping reveal cracks in the die and support the root cause conclusion.
Read the full paper to see how the FA workflow led from a severely damaged 3D module to root cause determination.
